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ATP

ATP Electronics, Inc.

Based in Taiwan, ATP specializes in the manufacture of memory cards and memory modules. Their strength is in the automotive, industrial, and medical markets, which demand high reliability.

Head officeTaiwan
Established1991
ProductsDRAM module
SD, micrSD, SSD
mSATA, SlimSATA
CFAst, CF, eUSB, etc.
URLhttps://www.atpinc.com/en


DRADRAM Solutions

ATP’s industrial DRAM modules are built tough and can meet the exacting demands of the growing enterprise. On call 24/7, these hardworking modules are fast, can withstand harsh operating  environments, and can handle large bandwidth requirements. ATP’s DRAM lineup consists of legacy SDRAM, and a complete range of DDR1, DDR2, DDR3, and DDR4 modules including the latest  DDR4-2666. They are available as RDIMM, RDIMM VLP, UDIMM/UDIMM ECC, SO-DIMM/SO-DIMM ECC, SO-CDIMM, Mini-RDIMM, FB-DIMM, and Mini-UDIMM/Mini-UDIMM ECC.


ATP DRAM Unique Features

* Industrial Temperature
ATP DRAM module can endure extreme temperatures ranging from -40°C to 85°C, ensuring long-term stability for systems installed in telecom, industrial and military/aerospace operations where consistant availability and steadfast performance are of critical importance. ATP’s modules undergo two levels of testing to ensure maximum reliability:

1.Advanced IC Level Testing screens for ICs with the best reliability and quality characteristics that are suitable for applications requiring wide temperature.
2.Enhanced Module Level Test During Burn-In (TDBI) and Automatic Test Equipment (ATE) guarantee that modules meet and even exceed qualifying parameters.

* Conformal Coating
A protective layer of parylene is applied to electronic circuits and modules, accessing spaces as narrow as 0.01 mm to shield against dust, chemical, extreme temperatures, moisture and corrosion. The coating film is formed by the chemical vapor deposition (CVD) process, and unlike dipping and spraying techniques, is completely pinhole free as the film conforms to any irregular shape, forming a vacuum-like environment to coat all components and points of failure.

* Increased Thickness, Strength
In order to ensure the quality of the signal transmission between the connector and ATP DRAM module, ATP utilizes gold finger plating with 30µ” thickness, compared to competitors’ DRAM modules thickness typically at less than 10µ”.

* Anti-Sulfur Resistors
Ordinary silver resistors corrode and become non-conductive when exposed to sulfur. ATP DRAM modules use anti-sulfur resistors that repel the damaing effects of sulfur contamination, quaranteeing continued dependable performance for a long time and lowering the total cost of ownership by preventing unnecessary downtime and expensive component replacements.


Flash Solutions

ATP’s industrial flash products deliver dependable performance, efficient responsiveness,and long usage life to accomplish mission-critical tasks. Sturdy and built to withstand rigorous operating environments, ATP flash storage comes in different form factors such as 2.5” SSDs, M.2 embedded modules, mSATA, SlimSATA, CFast, CompactFlash, SD/microSD memory cards, and USB drives for enterprise and industrial applications. They support high-speed interfaces such as SATA 6 Gb/s and the latest NVMe(tm) protocol on a PCIe(R) 3.0 x4 interface for reliable, blazing-fast, and future-ready performance. ATP’s latest flash offering is the automotive/industrial grade e.MMC, a managed NAND solution that complies with JEDEC Standard 5.1