Gpixel announces the GCINE product family, making state-of-the-art HDR image sensors commercially available for high-end video and photography.

2022.02.14

Gpixel which Kanematsu Futuretech Solutions (KFT) is the distributor in Japan, announces GCINE4349, a first product in the new GCINE product series, a next generation product family based on BSI stacked image sensor technology, providing truly innovative product options for cinematography, drones, production imaging and other video applications. In close collaboration with leading industry experts and leveraging its expertise in industrial, scientific CMOS (sCMOS) and photography products, Gpixel has developed a new generation product family, making the state-of-the-art commercially available to all video and photography camera developers. The GCINE product line features Back-Side Illumination (BSI) for high QE and angular response, as well as wafer stacking with exposure summing for HDR modes up to 110 dB (18+ f-stops) and 8K frame rates up to 120 fps.

GCINE4349, the first new product of this flagship family, is a 49MP (35.2 x 25.8 mm) full frame image sensor with a 4.3 μm² BSI pixels designed speciﬁcally for the demands and performance of high-end video imaging. With a maximum resolution of 8192 x 6000 pixels, several readout modes are supported to read out 8K or binned 4K video with maximum frame rates of up to 120 fps at 8K resolution and up to 240 fps at binned 4K resolutions, all with a pixel bit depth of up to 16 bit/pixel interfaced over 64 sub LVDS channels @ 1.2 Gbps/channel. In full frame you can use the full width of the sensor (8192 pixel) for 8K DCI widescreen, 2.4:1 8K wide or scope format, 8K open gate and various other creative imaging formats. The native 8K resolution and its 3:2 aspect ratio allows camera-level oversampling for outstanding 6K or 4K images in various resolution formats.

Figure 1. GCINE4349 image resolution formats (left) and product picture (right).

GCINE4349 is developed using a 2-wafer level stacked BSI architecture. The top layer consists of a BSI pixel array with 49M 4.3 um pixels achieving a maximum QE of up to 75% at 525 nm. The bottom digital CMOS layer consists of an array of core cells each including 16-bit ADC blocks and SRAM memory blocks which are used to sum and store up to 4 subsequent sub-frames with seamless exposure, enabling an in-pixel full well charge of up to 160k e- for a dynamic range of 80 dB.

Figure 2. 2-layer wafer level stacked BSI CMOS Image Sensor architecture of GCINE4349.

The advanced GCINE4349 architecture also supports two additional HDR modes to achieve excellent image quality across all imaging conditions. Firstly, a proprietary Variable Slope High Dynamic Range method achieving an exceptionally high 110 dB of Dynamic Range. Secondly, a classic dual gain read out achieving up to 87 dB of Dynamic Range. An additional Digital Still Camera (DSC) mode can be enabled for low noise read out down to 1.7 e- and dedicated shutter control for DSC operation.

GCINE4349 is packaged in a 431-pin LGA ceramic package and comes with a double side AR coated glass lid.

These unique features make GCINE4349 an ideal solution for high-end video, professional and prosumer photography, astrophotography, astronomy, and other high performance applications. Gpixel will keep expanding the GCINE sensor series and offer a broad portfolio of products suitable for high-end video and photography.

Purchase orders of prototype sample and evaluation board can be placed starting Q1 2022 and shipment will start Q2 2022. For more information, please visit the https://www.gpixel.com/products/area-scan-en/gcine/gcine4349/

About the GCINE sensor family

The GCINE family is Gpixel’s newest flagship product family of truly innovative products for cinematography, drones, production imaging and other video applications, utilizing backside illumination to achieve high sensitivity and exceptional dynamic range. For more information about the GCINE product family availability and roadmap,

For more information