March 1972 | Established Kanematsu Semiconductor Corporation in purpose for selling semiconductor and semiconductor manufacturing equipment. |
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April 2001 | Changed company name to Kanematsu Devices Corporation by merging with Kanematsu Semiconductor, Kanematsu Metal, and Kanematsu Electronic Trading. |
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October 2003 | Merged by Kanematsu Corporation and changed company name to Kanematsu Corporation Devices Company. |
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March 2004 | Obtained ISO14001 (i.e. International regulation for environment management) by Kanematsu Corporation. |
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August 2005 | Obtained ISO9001(i.e. International regulation for quality management) by Kanematsu Corporation Devices Company, Semiconductor Components Division・Semiconductor Equipment Division. |
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April 2012 | Merged entirely with Kanematsu Corporation and change Kanematsu Corporation Devices Division. |
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April 2013 | Changed division name to Kanematsu Corporation Electronics and Devices Division. |
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January 2018 | Split from Kanematsu Corporation Electronic Components & Semiconductor No.1, No2, Marketing Department and System & Module Department to establish Kanematsu Futuretech Solutions Corporation. |
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April 2018 | Starting business as Kanematsu Futuretech Solutions Corporation. |
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May 2018 | Moved the Head Office to Chuo-ku, Tokyo. |
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November 2019 | Assignment a business transfer from Fuji Film Optics Co., Ltd. for CMOS Image Sensor Assembly Division. |
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December 2020 | Opened business satellite office in Hamamatsu, Japan. |
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August 2021 | Integrated and registration change for ISO14001 and ISO9001 as Kanematsu Futuretech Solutions Corporation. |
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June 2022 | Obtained Secondhand dealer license as Kanematsu Futuretech Solutions Corporation. |
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