Semiconductor manufacturing

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We provide contract manufacturing service of semiconductor IC assembly mainly for Image sensor. Our assembly team had originally belonged to FUJIFILM Optics, one of the best digital camera brand company. Major assembly process operates under the best-in-class quality clean room Class 100. Additionally, we can support multiproduct lines from small volume productions. Class 100 makes high quality & low-yield level production environments. ​

Over 30 years of Image sensor production experiences, and a member of the Kanematsu group network in the world, which enable us to offer customers a wide range of assembly services for Image sensor, include custom designs, testing & inspections which collaborate with outsourcing companies. ​

Class100 Clean room​

HEPA Filter​

0.5um Zero Particle​

Down Flow Structure​

Image Sensor Package Variations ​

Ceramic Package​	iBGA​	Transparent Mold​
KFT​​	Outsource​​	Outsource​
COB（Chip on board)​	iCSP​
KFT​​	Outsource​
*Depends on Technical requirement​

Major Process of Image Sensor Assembly​

This is our major process of Image sensor assembly. We can also support additional process as per based on requests. ​

Major Process​

Dicing​

Die-bonding​

Wire-bonding​

Glass-sealing​

Production Record​

Biggest Area-sensor​

Longest Line-sensor​