We are pleased to introduce that next generation QCC3056 SOC based Bluetooth module. The QCC3056 is manufactured by Qualcomm Technologies, Inc. (i.e. Qualcomm) and is a low-power SoC that is also ideal for true wireless earbuds.
This module utilizes the functions of the QCC3056 and is compatible with transmission functions, so it can be replaced from Qualcomm’s Bluetooth SoC BC5 and CSR8670 chipset.
Module spec.
| Bluetooth version | Bluetooth 5.2 Low Energy(BLE) |
|---|---|
| Chipset | QCC3056 |
| Size | 13mm X 26.9mm X 2.2mm; Pad Pitch 1mm |
| Tx power | +13dBm (maximum) |
| Profiles | A2DP/AVRCP/HFP/HSP/HOGP/PBAP/SPP/GATT |
| Operation Voltage | 2.8V ~ 4.3V |
| Frequency | 2.402 – 2.480 GHz |
| Operation Temperature | -40°C to +85°C |
| Storage Temperature | -40°C to +85°C |
| Function | Ultra low power consumption Various audio functions Special audio quality by Snapdragon Sound |
Feature
- Snapdragon Sound applicable, High quality/Low latency
- Support transmit function
- Possible to replace from Qualcomm Bluetooth SoC BC5 and CSR8670 chipset.
- Control Bluetooth audio via UART
- Provide customized Firmware.
Application
- Bluetooth audio adaptor
- Bluetooth transceiver
- Bluetooth transmitter
In addition to providing products using the Qualcomm’s unique wireless technology, we will also provide development services such as tuning software and custom firmware with our unique know-how for Bluetooth-related products and sufficient achievements.
We have provided customized development services for applications such as IoT.
Please feel free to contact us.
For more information, please contact the following information.
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