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eYs3D Microelectronics, Co.

eYs3D Microelectronics, Co.
eYs3D Microelectronics is a fabless design company, spun off from Taiwan Etron Technology, Inc. in 2017, specializes in AI Processor, 3D stereo vision and image processing controller solutions utilizing computer vision hardware, software and AI technology.
 They provide stereo cameras, application processors and related products for object recognition and collision avoidance applications such as Cleaning robots, AGV/AMR and Drone etc.
Head OfficeTaiwan
Established2017
ProductsMultifunctional AI processor SoCs designed for edge computing, stereo depth camera subsystems, 3D ASIC ISPs and related products such as application software or SDK.
URLhttps://www.eys3d.com/

eYs3D Products offerings

・Image Processing ICs

・Edge Processor Ics

・Stereo Depth Cameras

・Box Computer

・Software Development Kit  (SDK)

Example of application function

•    Object detection

•    Distance information

•    People following

•    Point cloud acquisition

•    Face recognition

•    Depth analysis

•    Collision avoidance, etc.

Usecases

•Cleaning robots

•Industrial robots

•Service robots

•AGV・AMR

•Conference Camera

•Content Interactions

Main products

Image Processing ICs

eSP 2/5/6 Series 

       Webcam Series

       USB2.0

eSP 7 Series

        Dual-RX 3A ISP

       USB3.0 & MIPI

eSP 8 Series (Coming soon) 

       Stereo Depth ASIC

       USB3.0 & MIPI

eSP 9 Series (Coming soon) 

       Multi-ISP Series with WDR

Image Processing IC Products List

IC Part #eSP270DeSP736UeSP775UeSP876UeSP776UeSP777UeSP778U
Main DescriptionsVision ProcessorFHD 360 Camera Processor2K Stereo Vision Camera ProcessorHD 3D Depthmap ProcessorFHD Stereo Vision ProcessorApproached 4K Dewarp with LPDDR2 Stereo Vision ProcessorApproached 4K Stereo Vision Processor
CategoryUSB2.0 Cam360camSSSS+DMSSSS+DewarpWebCam
Depthmap EngineHD @60fps
Target ApplicationsUVC CAMFHD 360 Spherical CamerasAR/VR, Robot, 3D ScannerAR/VR/MR, AGV, Robots, Gestrue Control, VolumtricsAR/VR/MR, 3D ScannerTraining AR, Ultra-wide Angle HMD4K Single WebCam
Output InterfaceUSBUSB2.0/3.0USB2.0/3.0USB2.0/3.0USB2.0/3.0USB2.0/3.0USB2.0/3.0
MIPI1x MIPI 2L1x MIPI 2L1x MIPI 2L1x MIPI 2L2x MIPI 2L2x MIPI 2L
UVC/UAC
Compliance
UVC1.1UVC1.1UVC1.1UVC1.5UVC1.5UVC1.5UVC1.5
UAC1.0UAC1.0UAC1.0UAC1.0UAC1.0UAC1.0
Sensor I/F1x Parallel 8b2x Parallel 8/10b2x Parallel 8/10b2x Parallel 8/10b2x Parallel 8/10b2x Parallel 8/10b2x Parallel 8/10b
2x MIPI 2L2x MIPI 2L2x MIPI 4L2x MIPI 4L2x MIPI 4L2x MIPI 4L
Max. Sensor
Resolution
5MPx18MP x 18MP x 18MP x 1 or8MP x 1 or8MP x 1 or8MP x 1 or
13MP x 113MP x 113MP x 116MP x 1
ISP PerformanceSingle VGA @30fpsSingle HD @60fpsSingle FHD @30fpsSingle FHD @60fpsSingle FHD @60fps3840×2160 @15fps3840×2160 @15fps
Dual FHD @30fpsDual 1440p @24fpsDual FHD @30fps
Single 4Kx2K @15fps
Dual FHD @30fps
Single 4Kx2K @15fps
Dual HD @60fps
Dual 1920×1080 @15fps
Single FHD @40fps
Single 3840×2160 @15fps
JPEG CompressionDual FHD @30fpsFHD @30fpsSingle 4Kx2K @15fpsSingle 4Kx2K @15fpsDual HD @60fpsSingle FHD @40fps
Dual 1440p @24fpsDual FHD @30fpsDual FHD @30fpsDual 1920×1080 @15fpsSingle 3840×2160 @15fps
I2S AudioMicMicMicMicMicMic
Auto Focus StatisticsYesYesYesYesYesYes
SPI & I2C I/FYesYesYesYesYesYesYes
ROI Depth DetectionYes
Package TypeQFN32BGA144BGA144BGA248BGA248BGA153BGA153
Dimensions4×4 mm9×9 mm9×9 mm10x10mm10x10mm9x9mm9x9mm

3D depth map processor eSP876 Features

・Innovative 3D depth map processor with USB 3.0 support
Enables gesture/skeleton control via stereoscopic camera

・Generates real-time HD depth-mapped video streams
Simultaneous output of 3D colour video as well to the host

・Reduces power consumption compared to CPU/GPU’s depth map processing
Extends runtime of battery-powered applications

・Supports RGB raw/Motion JPEG HD Color and depth map data processing @ 60FPS with SDK   Supports data processing @ 60 FPS

Stereo Depth Map Data Calculation:

Edge Processor ICs

eCV 7 Series (Coming soon)

       Optical Flow

       CV Controller

eCV 4 Series (Coming soon)

       Time-of-Flight Processor      

 eCV 5 Series

       Application Processor

 eCV 33 Series (Coming soon)

       Sense & React A.I. Processor

AI Edge Computing SoC eCV5546 Features

・12nm chip technology, small size and low power consumption

・Integrated 4.6 TOPS AI processor and 1.8 GHz quad ARM A55 CPU
The ARM M4 MCU supports machine control and always-on operation when the main functional blocks are paused

・Built-in H.264/JPEG codec

・USB 3.1DRD and USB 2.0 OTG support host and device roles and can act as a processor in a slave device, either as the central unit of the system or as a processor in a slave

・Up to four MIPI CSI RX interfaces,   fulfils the multi-camera requirements of most AMR/AGV or slave devices

AI Edge Computing SoC eCV5546 Specification

Model/Part numbereCV5546
CPU ArchitectureQuad ARM Cortex A55
M4 always on
SpeedUp to 1.8 GHz
NPU (TOPs)4.6 ToPs
AI frameworkTensorflow, TFLite, Keras, ONNX, Caffe, Darknet, and PyTorch
OS supportLinux
MemoryUp to 8GB LPDDR4
StorageeMMC and SD card
Video codecH.264/SVC and JPEG
CameraMIPI CSI x 3
DisplayMIPI DSI
ConnectivityMIPI CSI RX x4
MIPI DSI/CSI TX x1
USB 3.1 Gen1 up to 5Gbps
USB2
SDIO x2
GigaE x1
I2S
Ethernet10/100/1000 Mbps Ethernet *
PackagesFCCSP
Dimension15x15mm2
Process12 nm
ApplicationAGV/AMR
Service Robot
Industrial Robot
Home Robot
SLAM (Localization and Mapping)
Sensor Fusion
Gesture control
Skeleton
Semantic Segmentation
Object Recognition/Detection

Block diagram

Stereo Depth Cameras

G62 

       Super small factor

       Low power consumption

       Short range

       High Frame Rate + Accuracy

R77

       Short and Middle range

       High Frame Rate + Accuracy

       Total darkness,
  indoor strong light,
  weak light,         

       backlight and smooth light,
  semi-outdoor      

G100+

       Long range

       Large FoV Depth Capture
  with High Accuracy

       Color + Depth Output       
  Ingress protection: IPX3

Stereo Depth Cameras simplified chart

Product CodeG62R77G100+
FeaturesSuper small factor
Low power consumption
Short range
High Frame Rate + Accuracy
Incorporates eYs3D’s 3D Depthmap Processor eSP876
Supports distance measurement sparse mode up to approx. 16 m.
Short and Middle range
High Frame Rate + Accuracy
Total darkness, indoor strong light, weak light, backlight and
smooth light, semi-outdoor
Incorporates eYs3D’s 3D Depthmap Processor eSP876
Supports distance measurement sparse mode up to approx. 16 m.
Long range
Large FoV Depth Capture with High Accuracy
Color + Depth Output
Ingress protection: IPX3
Incorporates eYs3D’s 3D Depthmap Processor eSP876
Supports distance measurement sparse mode up to approx. 16 m.
Size50 x 20 x 14.9 mm90 x 25.5 x 25 mm99.6 x 27.4 x 29.2 mm
Weight29.3g96g137g
Sensor InputMIPIMIPIMIPI
OutputsUSB2.0USB2.0USB2.0 / USB3.2 Gen 1
Chroma outputB&WB&WRGB
FOV62(H)x43(V)77(H)x60(V)95(H)x63(V) @ 1280 x 720
Depth resolution640×480 @ 25FPS1280×9201280×720 @ 60FPS
Depth range10-150cm20-150cm25-190cm
Base Line3cm4.5cm6cm
Lens filterIR SingleIR SingleRGB + IR Dual
Shutter typeGlobalRollingGlobal
Use casesCleaner Robot obstacle avoidance
AR/VR
Drone
People/Object Counting
Motional Obstacle Detection at Short Range
Detect Obstacles such as Reflective and Black/White Cables
Object recognition at the end of a robot arm
Robot obstacle avoidance
RGV / AMR
Motional Obstacle Detection at Short Mid-Range
Detect Obstacles such as Reflective and Black/White Cables
Robot obstacle avoidance
RGV / AMR
Monitoring human and car presence
AR/VR
Drone
Sensor Fusion for SLAM
Distance Information
Dynamic Range & Object in Motion

Outputs RAW data of depth/coordinates

SDK/DMPrevew

The programs, APIs, sample code and development documentation required for the development of application software are packaged together and provided free of charge.

For checking point cloud data and other video output, the free SDK/DMPreview can be used.

DMPreview is available on GitHub as an SDK containing software executables, related source code and API documentation.

Sample images of 20-40 cm distance measurement

Sample images of 20-40 cm distance measurement – Point cloud acquisition

Sample image of 100 cm distance measurement

Sample image of 100 cm distance measurement – Point cloud acquisition- Two-dimensional image comparison

Black/white cable detection sample images

Sample image of black/white cable detection point cloud

Box Computer

 XINK Platform

• AI Edge Computing SoC
eCV5546 inside

• Applicable to development, evaluation and mass-produced products

• Provide various instructional documents and sample codes

  

Basic specifications
• USB:
 Type-C(USB3.1 Gen2) x 1
 Type-A(USB2.0) x 1
• Wi-Fi, RJ45(1Gbps), Bluetooth
• MIPI: Input x 1, Output x 1
• Power: 12V,  2A(Minimum)
•Memory:MicroSD, 16GB eMMC, 4G DRAM
•Signals:GPIO x 4, PWM x 4, 5V, GND

For more information

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