Case Study

Image Sensor Module assembly COB(Chip on Board) Package Production Contract Manufacturing Service​

We can produce COB-package which directly die-bond (DB) and wire-bond (WB) Image sensor chip onto PCBA. ​

One Stop service” is available from procurement of raw materials such as PCB, IC and other related materials to final assembly of COB-package. ​

Problems

R&D of soft X-ray/EUV conducted in a vacuum environment

  • No suitable camera that is easy to use and install
  • Limited space for installation
  • Lacking in support for use (measures for outgassing, etc.).​

Solutions​

  • Only the sensor-head can be installed into a vacuum environment by separating the sensor-head from the camera body, and it makes easier to set up the camera.
  • R&D of Soft X-ray/EUV is facilitated by using a sensor sensitive to UV-area.

Background to Introduction

COB production of Image sensors is possible.​

COB package requires a lot of sub-components such as IC, PCB, Heatsink compared to normal package types, which increases supplier management cost. ​

Our One Stop solution helps you to reduce management cost and to improve production efficiency.​
We can provide One Stop service from procurement of raw materials to final assembly of COB-package. ​

With Using our global network of Kanematsu Group and our Image sensor production know-how over 30 years, we can offer you high quality and flexible contract manufacturing services. ​

Major Process for COB package​

We can provide “One Stop service” from material procurement to finished Image sensor module, as COB-package requires sub-component items compared to Normal Ceramic package process. ​

Message

Any requirements for special products and/or small volume are all welcomed. ​

With our global network of Kanematsu Group and our Image sensor production know-how over 30 years, we can offer you high quality and flexible manufacturing services.​

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